FOOMA JAPAN is a showcase of products, technologies, and services for food …
Date: 2022-10-23 – 2022-10-26
Location: Chicago,Illinois/USA
Fair Ground: McCormick Place
PACK EXPO international is one of the largest North American trade shows for the processing and packaging industries. Here, companies look for the latest, most innovative equipment and materials to improve production efficiencies along the entire supply chain of the food processing industry.