Fispal Tecnologia in Sao Paulo is a trade fair for packaging, processes and …
Pack Expo Chicago
Date: 2018-10-14 – 2018-10-17
Location: Chicago,Illinois/USA
Fair Ground: McCormick Place
Booth: South Building - 2789
PACK EXPO international is one of the largest North American trade shows for the processing and packaging industries. Here, companies look for the latest, most innovative equipment and materials to improve production efficiencies along the entire supply chain of the food processing industry.